:: 06, Dec 2011 :: A*STAR INSTITUTE OF MICROELECTRONICS AND TEZZARON TEAM UP TO DEVELOP 2.5D/3D THROUGH-SILICON …

December 7, 2011 | TECHNOLOGY

Singapore, 6 December 2011- The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology.

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Tags: :: 06, Dec 2011 :: A*STAR INSTITUTE OF MICROELECTRONICS AND TEZZARON TEAM UP TO DEVELOP 2.5D/3D THROUGH-SILICON ..., collaboration agreement, DEVELOP, INSTITUTE, institute of microelectronics, star institute, THROUGH-SILICON

TheAsiaBIZZ.com

:: 06, Dec 2011 :: A*STAR INSTITUTE OF MICROELECTRONICS AND TEZZARON TEAM UP TO DEVELOP 2.5D/3D THROUGH-SILICON …

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